| Description |
Description |
| a |
Conductor Width (Inner
Layer / Outer Layer)
|
¡Ã
t + 100 §
(¡Ã t + 4 mil )
|
|
| b |
Conductor
Space (Inner Layer / Outer Layer)
|
¡Ã
t |
| c |
Copper Thickness Tolerance
( ¡Â 7 oz )
Copper Thickness Tolerance ( > 7 oz )
|
+1.4
oz / -1.0 oz
+1.4 oz / -2.0 oz |
| d |
Clearance of Conductor to Substrate Edge (Punching)
Clearance of Conductor to Substrate Edge
(Routing) |
¡Ã
c + 1.0 mm
(¡Ã c + 40 mil )
¡Ã 1.0 mm (¡Ã 40 mil ) |
| e |
Under
Etching
|
¡Â
50% of Copper Thickness
|
f |
Min. Thickness of Dielectric
Layer
|
¡Ã 50
§ (¡Ã 2 mil ) |
g |
Thickness of TGFR (Track
Gap Filled Resin)
|
g =
c
|
| |
|
|
Conductor
Trace
