Application
PAM (Power Amp Module) in Mobile Phone
Description
Materials : FR4, PPE, PPO, BT, PI, PEEK, and etc..
Size : 0.236 x 0.315
Fill via holes with thermally conductive paste to maximize thermal effects
Application
VCO
(Voltage Control Oscillator) in Mobile Phone
Description
Size : 0.196 x 0.216
Maximize reliability of PCB and promote efficiency of assembling process
Application
Omnidirectional Electret Condenser Microphone
Description
Diameter 0.216 , Thickness 7.8 mil
Maximize reliability of PCB and promote efficiency of assembling process
Application
System Module for Telecommunication
( Embedded Processor Module )
Description
4.33 x 2.95
12 Layers, Thickness 0.07
Improve in the reliability of BGA Pads
Application
Socket Board
Description
1.97 x 2.44, 14 Layers , Thickness 0.11
Impedance Control
Laminate : PPE ( Kyocera TLC-596 ME)
Application
Memory Ram Stack
Description
4.33 x 2.95 , 2 Layers , Thickness 0.013
Patterns Registration : +/- 2 mil
Surface Finishing : White Tin, Entek, Flash Gold
Maximize reliability of PCB and promote efficiency of assembling process