Advantages from HPL Techniques
          Prevent bridging between closely spaced holes
          Eliminate solder flow up via holes during assembly
          Eliminate solder balling
          Reducing the resistance and inductance of grounding connections
          Maximize thermal and electrical conductivity with thermally
          conductive paste
          Minimize flux residues and ionic contamination
          Secure reliability of BGA PAD
          Secure working space by minimizing via land
          Minimize signal noise
          Minimize PCB size
          Significant reduction in the amount of processing steps required
            manufacturing sequentially built up boards by eliminating many of the
          expensive plating and lamination steps