The HPL, hole plugging land, is the techniques plugging via holes with conductive or non-conductive paste, and metalize on the top and bottom of the via holes to form SMD pads. HPL techniques provide circuit designers the solutions to save surface area for wiring, and to deal with customers’ needs requiring HDI design for area array packages. HPL techniques also enable thermal management of surface mounted active devices by plugging the via holes with thermally conductive paste.

  HPL techniques offers a unique opportunity to improve the performance of sensitive designs while providing a more cost effective assembling operations, and eliminating reliability problem in manufacturing and assembling.