|
The
HPL, hole plugging land, is the techniques plugging
via holes with conductive or non-conductive paste, and
metalize on the top and bottom of the via holes to form
SMD pads. HPL techniques provide circuit designers the
solutions to save surface area for wiring, and to deal
with customers¡¯ needs requiring HDI design for area
array packages. HPL techniques also enable thermal management
of surface mounted active devices by plugging the via
holes with thermally conductive paste. |