Conductor Trace
Description
Standard
Advance
Description
a
Min. Trace Width
Copper Thickness + 50 ㎛ ( Copper Thickness + 2 mil )
Copper Thickness
b
Min. Trace to Trace Clearance
Copper Thickness + 75 ㎛ ( Copper Thickness + 3 mil )
Copper Thickness + 50 ㎛ ( Copper Thickness + 2 mil )
c
Min. Pad to Substrate Edge
( Press Punching)
Board Thickness + 200 ㎛
( Board Thickness + 8 mil )
Min. Pad to Substrate Edge
( Routing)
150 ㎛ (6 mil)